Location - Bay Area, CA
Skills - CoWoS Packaging Engineer
Position Overview
We are seeking a skilled and motivated CoWoS Packaging Engineer to join our growing team. This role focuses on the development and optimization of Chip-on-Wafer-on-Substrate (CoWoS) packaging technology to support high-performance AI and data center applications. You will collaborate with design, process, manufacturing, and materials teams to enable seamless integration of advanced multi-die packages. If you are passionate about cutting-edge semiconductor packaging and want to help shape the future of AI infrastructure, we’d love to hear from you.
Responsibilities
Qualifications
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